| Allicdata Part #: | ATS27573-ND |
| Manufacturer Part#: |
ATS-16F-84-C2-R0 |
| Price: | $ 4.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16F-84-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.87450 |
| 10 +: | $ 3.77055 |
| 25 +: | $ 3.56126 |
| 50 +: | $ 3.35185 |
| 100 +: | $ 3.14231 |
| 250 +: | $ 2.93283 |
| 500 +: | $ 2.72334 |
| 1000 +: | $ 2.67097 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are an essential component of many electronics systems, providing heat dissipation and handling for components that require additional cooling due to heat generated from their operation.
The ATS-16F-84-C2-R0 Thermal-Heat Sink is one of the latest products from Aimtron Technology Corporation, a well-known supplier of Thermal-Heat Sinks. This heat sink is designed to provide superior heat dissipation and handling capabilities to meet the highest criteria of performance and reliability in electronic systems.
The ATS-16F-84-C2-R0 Thermal-Heat Sink is made from aluminum, providing high thermal conductivity and excellent thermal transfer. With an optimal design for heat dissipation, the ATS-16F-84-C2-R0 can dissipate heat quickly and efficiently. The heat sink features a unique fin design to create larger surface area to increase convection and radiation to maximize the cooling efficiency. The fin technology is designed to ensure that the airflow is directed to the optimum location for maximum cooling efficiency and improved heat dissipation.
In addition, the ATS-16F-84-C2-R0 Thermal-Heat Sink is designed to be compatible with many types of electronic components, from chips to silicon-based systems. It is ideal for applications in embedded systems, computer networks, industrial control systems, and power supply systems.
The ATS-16F-84-C2-R0 Thermal-Heat Sink working principle is based on thermal conduction and convection. Thermal conduction is the transfer of heat from one part of the heat sink to another part that is at a lower temperature, while convection is the transfer of heat from a device to the surrounding environment via air or liquid dissipation. In the case of the ATS-16F-84-C2-R0, thermal conduction is used to move the heat away from the device, while convection is used to move the heat away from the device to the surrounding environment.
In applications where high levels of heat dissipation are required, such as in embedded systems and industrial control systems, the ATS-16F-84-C2-R0 thermal-heat sink can provide efficient cooling with minimal noise. This heat sink is designed to be cost-effective, making it a great choice for electronic systems that need to be able to dissipate a large amount of heat in a short amount of time.
The ATS-16F-84-C2-R0 thermal-heat sink is an excellent choice for many electronic systems. It is designed for maximum cooling efficiency and features optimal design for heat dissipation. The ATS-16F-84-C2-R0 provides superior thermal performance to ensure maximum reliability and to keep the system running smoothly.
The specific data is subject to PDF, and the above content is for reference