| Allicdata Part #: | ATS16172-ND |
| Manufacturer Part#: |
ATS-09E-152-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-152-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are used in a wide variety of electrical and electronic applications. The ATS-09E-152-C2-R0 Heat Sink is an ideal choice for controlling temperatures in sensitive applications. It is designed to provide efficient heat dissipation while still maintaining structural integrity. The device is designed to effectively dissipate heat generated from surface-mounts components, such as power supplies, processors, transistors, etc.
The ATS-09E-152-C2-R0 Heat Sink is constructed from aluminium and features a finned surface area. This ensures that more surface area is exposed to air for better thermal conductivity. The fins are designed to be aerodynamic to reduce turbulence and enhance heat dissipation. The device also includes a low impedance metal spring clip. This makes installation easy and secure, as the fins are reliably pressed against the mounting surface.
The ATS-09E-152-C2-R0 Heat Sink utilizes a heat transfer medium, such as thermal paste or thermal pads, to provide maximum heat transfer. This ensures that temperatures stay in check, even in high-end applications. The device has a temperature rating of up to 70 °C, allowing it to work in various industrial and commercial applications. The device also has an operating temperature range of -55 °C to 125 °C, making it suitable for use in extreme temperatures.
The device is also designed to be jetted or pin-attached to the component it is connected to. This eliminates any extra mounting hardware and ensures that the device is securely and properly installed. The device is also compatible with both through-hole and surface-mount components, maximizing its versatility.
The ATS-09E-152-C2-R0 Heat Sink is designed to reduce total system heat load and to ensure cooling efficiency in a wide variety of applications. The device is available in a variety of sizes and offers a cost-effective heat sink solution. Due to its compact size and low profile, the device is ideal for use in confined spaces or tight areas.
The specific data is subject to PDF, and the above content is for reference