| Allicdata Part #: | AER19-19-12CB/A01-ND |
| Manufacturer Part#: |
AER19-19-12CB/A01 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CTS Thermal Management Products |
| Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  AER19-19-12CB/A01 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 3.02098 |
Specifications
| Series: | AER |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.732" (18.60mm) |
| Width: | 0.732" (18.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.457" (11.60mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.42°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 15.85°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Description
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AER19-19-12CB/A01 belongs to the Thermal - Heat Sinks category and is a type of heatsink used to dissipate the heat generated by electronic devices. It is designed with an slim aluminum profile and black anodized finish, making it an ideal solution for space-restricted applications where a metal heatsink is needed. The unique fin shape maximizes air flow and cooling capability while providing a thermal resistance of 1.22 °C-in2/W or 0.71 °C-cm2/W. Its optimized base design dramatically increases heat transfer from the base.
The AER19-19-12CB/A01 is used primarily in the automotive, medical, industrial, instrumentation, and consumer electronics industries. It is designed to be used in applications where space is limited and efficient heat dissipation is necessary, such as computers, servers, power amplifiers, power supplies, and electronic equipment. It is highly effective in cooling applications where higher air velocity is desired.
The heat-sink works by utilizing a combination of convection and conduction to dissipate heat from the electronic components. Heat is generated by the components and then radiates outwards from the base of the heatsink. The expanded surface area of the fins increases the surface area available for heat transfer and improves the heat dissipation by circulating air around the fins. The airflow from the fans and the air flow around the fins increases the amount of heat that can be dissipated from the system. The combination of convection and conduction increases the rate of heat transfer from the electronic component to the ambient air.
The AER19-19-12CB/A01 has a durable black anodized finish and a smooth profile that provides an aesthetically pleasing appearance. It is designed to be lightweight and easy to install. The included mounting hardware allows it to be mounted quickly and securely. The special fin shape maximizes the area of surface area contact for heat exchange to provide the highest thermal performance.
In summary, the AER19-19-12CB/A01 is an excellent choice for applications where efficient heat dissipation is required. It is lightweight, easy to install, and provides excellent thermal performance. Its slim aluminum profile and black anodized finish make it an ideal solution for space-restricted applications. It can be used in a variety of industries such as automotive, medical, industrial, instrumentation, and consumer electronics and is designed to provide superior thermal performance in applications where higher air velocity is desired.
The specific data is subject to PDF, and the above content is for reference
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