ATS-17G-171-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17G-171-C3-R0-ND

Manufacturer Part#:

ATS-17G-171-C3-R0

Price: $ 3.73
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17G-171-C3-R0 datasheetATS-17G-171-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.38814
30 +: $ 3.29658
50 +: $ 3.11346
100 +: $ 2.93026
250 +: $ 2.74713
500 +: $ 2.65555
1000 +: $ 2.38083
Stock 1000Can Ship Immediately
$ 3.73
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are mechanical components used to dissipate heat from areas with high thermal loads in an electronics system. There are many types of heat sinks available, depending on the requirements of the application. The ATS-17G-171-C3-R0 heat sink is a high-performance heat sink designed for use with high-power semiconductors. It is particularly well-suited for applications in high-density Printed Circuit Boards (PCBs).

The construction of the ATS-17G-171-C3-R0 heat sink consists of a central aluminum fin core surrounded by two ring-style aluminum fins. These fins are made of high-grade aluminum alloy, which ensures optimal heat dispersion. The heat sink also includes two heat pipes at each end, which provide additional heat transfer efficiency. The overall design of the ATS-17G-171-C3-R0 heat sink ensures optimum cooling performance with minimal space requirements.

The ATS-17G-171-C3-R0 heat sink is designed for use with components that require very high thermal loads, such as power ICs and power MOSFETs. The heat sink is particularly effective in dissipating heat generated from high-power components, as the aluminum fins ensure maximum cooling efficiency. The two heat pipes located at the ends of the heat sinkallow for additional heat transfer from the center of the fins, further increasing the thermal performance. Additionally, the design of the heat sink ensures minimal turbulence and noise.

The ATS-17G-171-C3-R0 heat sink is most commonly used in industrial and commercial applications that require high thermal transfer rates. It is particularly suitable for use with high-power applications that have limited space requirements. Additionally, the heat sink can be used in applications where high temperatures and temperature gradients need to be managed. Its high-performance capabilities make it an ideal solution for applications that require maximum thermal performance.

The working principle of the ATS-17G-171-C3-R0 heat sink is based on the heat transfer process. Heat is generated from the electronics system, which is then transferred to the heat sink. The heat is dissipated through natural convection, conduction, and radiation. Natural convection utilizes the natural airflow around the heat sink to cool the components. Conduction is the process of heat transfer by direct contact between the individual fins and components. Radiation is the process of heat transfer by emission and absorption of infrared radiation.

The ATS-17G-171-C3-R0 heat sink is a high-performance thermal solution for applications with high thermal loads. Its innovative design ensures optimal heat transfer capabilities with minimal noise and turbulence. Additionally, the two heat pipes at each end provide effective heat transfer from the center of the fins, further increasing the thermal performance. The ATS-17G-171-C3-R0 heat sink is an ideal solution for applications that require maximum thermal performance in a limited space.

The specific data is subject to PDF, and the above content is for reference

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