| Allicdata Part #: | ATS-21A-127-C3-R0-ND |
| Manufacturer Part#: |
ATS-21A-127-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-127-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are essential components of the modern electronic infrastructure and are used to dissipate the heat produced by a variety of electronic devices to prevent overheating of the device or its components. ATS-21A-127-C3-R0 is one type of heat sink that is specifically designed for use with thermal interface materials (TIMs). This particular type of heat sink is most commonly used in commercial and industrial applications for cooling high-power electronic equipment and components. The ATS-21A-127-C3-R0 utilizes a low-profile design to fit within a variety of locations.
The ATS-21A-127-C3-R0 heat sink is made from a high quality aluminum alloy to provide excellent thermal conductivity. The heat sink features a simple design, with fins that are arranged in a linear fashion. The spaced-out fins maximize the area for conduction, allowing the heat to be spread out across the entire heat sink. The ATS-21A-127-C3-R0 also features pin fins that allow for a more effective transfer of heat from the chip to the sink. The pins are machined to a very tight tolerance to ensure that the interface between the chip and the heat sink has minimal resistance.
The ATS-21A-127-C3-R0 heat sink is designed to work with any type of thermal interface material (TIM). TIMs are designed to fill any gaps between the surface of the heat sink and the electronic component. This enables the heat generated by the electronic component to be evenly dispersed over the entire surface of the sink. The use of a TIM also helps to eliminate any air pockets or voids which could decrease the efficiency of the heat transfer.
The ATS-21A-127-C3-R0 heat sink is designed to perform to a high level of efficiency, even under extreme temperature conditions. The heat sink is designed to be resistant to corrosion and oxidation, and can operate reliably in temperatures up to 70 degrees Celsius. The heat sink is designed to dissipate heat quickly and has a large area for heat dissipation, allowing it to effectively cool components in tight spaces. The heat sink is also designed to be compatible with a wide variety of TIMs, and is designed to work with high-power components.
The ATS-21A-127-C3-R0 heat sink is an effective and reliable cooling solution for high-powered electronic devices. The heat sink is designed to be durable and reliable, and is capable of dissipating heat quickly and efficiently. The heat sink is also designed to be compatible with a variety of thermal interface materials, making it a versatile cooling solution for a variety of applications. With its simple design and high level of efficiency, the ATS-21A-127-C3-R0 heat sink is an excellent choice for cooling high-powered electronic devices.
The specific data is subject to PDF, and the above content is for reference