Allicdata Part #: | ATS-02A-190-C3-R0-ND |
Manufacturer Part#: |
ATS-02A-190-C3-R0 |
Price: | $ 4.52 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-02A-190-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 4.07169 |
30 +: | $ 3.84531 |
50 +: | $ 3.61910 |
100 +: | $ 3.39293 |
250 +: | $ 3.16673 |
500 +: | $ 2.94054 |
1000 +: | $ 2.88399 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 3.70°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are widely used in a variety of applications and the ATS-02A-190-C3-R0 is no exception. This heat sink is designed for applications in which a large amount of heat needs to be removed from a source, such as a computer processor or digital circuit board. The design of the heat sink is tailor-made for a variety of sizes and types of components. In most cases, it is integrated in devices with multiple layers, such as motherboards, network boards, and so on. Thus, it can provide heat dissipation from both sides of the PC board.
The ATS-02A-190-C3-R0 is made from high-quality aluminum alloy and includes a number of features that are essential in ensuring efficient and effective heat dissipation. The aluminum fins are designed to create a large surface area which is beneficial for heat dissipation as more heat can more easily escape rather than accumulating in one spot. This heat sink also has an extruded finned design which further enhances its ability to dissipate heat quickly. Additionally, the extruded fins are designed to increase the amount of air that moves across the fins allowing for better convection cooling. The fins also provide a soft edge allowing for long-term use and less chance of damage to other components.
The ATS-02A-190-C3-R0 is also fitted with a thermally conductive adhesive material on its back that ensures improved heat transfer from the component or device to the heat sink. This serves to fulfill the goal of thermal dissipation more effectively. Additionally, the adhesive ensures that the heat sinking process is not hampered by air pockets, thus further improving the performance of the thermal device.
Aside from the thermal-conductive adhesive, the ATS-02A-190-C3-R0 also includes a thermal interface material which is placed between the heat sink and the component. This material improves the thermal interface and allows heat to be more effectively distributed across the component. The thermal interface material also reduces the amount of contact that the heat sink has with the component, resulting in improved cooling performance.
Overall, the ATS-02A-190-C3-R0 is an excellent choice for applications requiring efficient thermal management. With its efficient design, high-quality materials, and thermally conductive adhesive, the ATS-02A-190-C3-R0 heat sink is suitable for a variety of uses. Its ability to effectively dissipate heat ensures that it is one of the best thermal solutions on the market.
The specific data is subject to PDF, and the above content is for reference