| Allicdata Part #: | ATS-09B-103-C3-R1-ND |
| Manufacturer Part#: |
ATS-09B-103-C3-R1 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-103-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.14099 |
| 30 +: | $ 3.91083 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are crucial components in many electronic devices as they help in controlling temperature and dissipating heat. In particular, the ATS-09B-103-C3-R1 thermal heat sink is an ideal choice for various applications that need heat dissipation. This article will explain the application field and working principle of the ATS-09B-103-C3-R1.
Application Fields
The ATS-09B-103-C3-R1 thermal heat sink is suitable for use in various applications requiring heat dissipation. It can be used for cooling power transformers and coils, power switching regulators, motor drivers, and power supplies. It is also suitable for use in audio amplifiers, DC-DC converters, heaters, relays, and more. Thermal heat sinks like the ATS-09B-103-C3-R1 are designed to provide efficient and reliable heat dissipation in a wide range of applications.
Working Principle
The ATS-09B-103-C3-R1 thermal heat sink works on the principles of convection and conduction. It incorporates a metal alloy base with thermal conductive material that absorbs heat from the device and then transfers it onto the thermal fins. The thermal fins are designed with a wide surface area, so the heat is spread throughout the fins, preventing overheating of the device. And as the fins are exposed to the surrounding environment, air is drawn over the fins and dissipates the heat.
The ATS-09B-103-C3-R1 thermal heat sink also features a unique design that allows it to be mounted onto a variety of surfaces for maximum efficiency. This feature ensures that the thermal heat sink is placed in the optimal location for effective heat dissipation. Additionally, the thermal heat sink is durable and reliable, ensuring that it can provide optimal performance for a long period of time.
Conclusion
The ATS-09B-103-C3-R1 thermal heat sink is a reliable and efficient choice for many applications requiring heat dissipation and temperature control. Its unique design and features make it an ideal choice for applications that require maximum efficiency and reliability. Its application fields are extensive and it works on the principles of convection and conduction to effectively dissipate heat and prevent components from overheating. Thus, the ATS-09B-103-C3-R1 thermal heat sink is an excellent choice for a variety of electronic device applications.
The specific data is subject to PDF, and the above content is for reference