ATS-10H-37-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10H-37-C1-R0-ND

Manufacturer Part#:

ATS-10H-37-C1-R0

Price: $ 5.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10H-37-C1-R0 datasheetATS-10H-37-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.88124
30 +: $ 4.60992
50 +: $ 4.33881
100 +: $ 4.06766
250 +: $ 3.79648
500 +: $ 3.52531
1000 +: $ 3.45751
Stock 1000Can Ship Immediately
$ 5.43
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management systems are vital in modern electronics. Heat sinks are an important component of these systems due to their ability to keep components cool and pass heat away from the system. ATS-10H-37-C1-R0 is a popular thermal heat sink that is used in a wide range of systems and applications. In this article, we will explore the application field and working principle of the ATS-10H-37-C1-R0.

The ATS-10H-37-C1-R0 thermal heat sink is designed for a variety of applications. It is commonly used in high-powered systems such as server racks, gaming consoles, and high-end PCs. It is also used in 3D printers, scientific equipment, and power supplies. The ATS-10H-37-C1-R0 is a highly reliable heat sink that can operate in temperatures up to 105°C.

The ATS-10H-37-C1-R0 thermal heat sink utilizes an innovative design that efficiently removes heat from components while still maintaining a low profile. The heat sink is composed of a series of extruded aluminum fins arranged in a "sawtooth" pattern. This design increases the surface area of the heat sink, allowing for greater heat dissipation. The aluminum fins are also interconnected, allowing for better heat transfer between the fins. This ensures that all components are kept at a lower temperature.

The ATS-10H-37-C1-R0 thermal heat sink is designed to be highly efficient. The extrusion process and sawtooth design allow for increased air flow, which helps to disperse heat more effectively. The aluminum fins also act as a heat spreader, spreading the heat away from the component. The fins also act as a conductor, allowing the heat to be more evenly distributed across the heat sink. This ensures that components are not overloaded with heat.

In addition to its high efficiency, the ATS-10H-37-C1-R0 thermal heat sink also offers a high degree of flexibility. The heat sink can be configured in a variety of ways. This allows the user to customize the sink for their application. The heat sink can also be mounted on different surfaces, allowing for greater versatility.

The ATS-10H-37-C1-R0 thermal heat sink is a reliable and highly efficient thermal management solution for modern electronics. It is easy to install and configure, and offers high levels of flexibility. The sawtooth design and extruded aluminum fins allow for high levels of heat dissipation, keeping components running cooler for longer. The versatility of the design also makes the ATS-10H-37-C1-R0 an ideal solution for a wide variety of applications.

The specific data is subject to PDF, and the above content is for reference

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